Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...
The semiconductor equipment industry has witnessed a gradual increase in the proportion of packaging and testing equipment, with the continuous advancement of advanced packaging. Die bonding plays a ...
Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...
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